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Size: 620mm X 690mm X 570mm
Max. Working Area: 200mm X 260mm
Air Pressing: 0.45-0.7***
Weight: 95Kg
Feature:
1. Extremely short cycle time with rotary table design. Product loading and
unloading can be done during the heat sealing process
2. High quality heat seal application up to 0.25mm pitch
3. Pneumatic bonding head provide up to 3,900N force
4. Digital programmable pressure control with LCD display
5. Closed loop PID temperature control with visible LED display
6. Bonding cycle is triggered by a real time pressure sensor
7. Floating Thermode ensure consistent pressure and heat transfer
along the flexfoil to LCD and/or PCB
8. Precision product fixtures (2X), easy exchange, provided with micrometer
alignment and vacuum to fix components
9. Optional CCD alignment module with frame, camera, lens, monitor and
illumination for fine pitch application
10. Full microprocessor logic control
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| Company: |
Chuang wei electronic equipment manufactory
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| Contact: |
Ms. Cathy Fang |
| Address: |
No.8kangxiang street changan town dongguan city |
| Postcode: |
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| Tel: |
86 769 89990229 |
| Fax: |
86 769 85848625 |
| E-mail: |
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